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COMSOL Multiphysics 4.2

sales price : $ 65.00


This is full retail version not academic or student can use it forever have no time limite.comes only a dvd-r disk and all code needed,step by step installation instruction.
World wide shipment,you will get it within 8 working days.

COMSOL Multiphysics 4.2

COMSOL Multiphysics 4.2 represents a significant expansion of the software's applications, features, and functionality. Version 4.2 empowers current users to do more with their simulation environments, while new industries will now be able to leverage the innovation of multiphysics simulation. With this release, COMSOL continues to deliver on its promise to supply the science and engineering markets with the state-of-the-art simulation products for an expanding set of applications.

Geomechanics Module

The Geomechanics Module is a specialized add-on to the Structural Mechanics Module for simulation of geotechnical applications such as tunnels, excavations, slope stability, and retaining structures. The Module features tailored interfaces to study plasticity, deformation, and failure of soils and rocks, as well as their interaction with concrete and human-made structures.

Simulations of a retaining wall (left), a tunnel excavation (middle) and a flexible footing (right) using the Geomechanics Module

LiveLink™ for AutoCAD®

With the new LiveLink for AutoCAD interface you can transfer a 3D geometry from AutoCAD to COMSOL Multiphysics. The synchronized geometry in the COMSOL model stays associative with the geometry in AutoCAD. This means that settings applied to the geometry, like physics or mesh settings, are retained after subsequent synchronizations. The LiveLink interface is also bidirectional to allow you to initiate a change of the AutoCAD geometry from the COMSOL model.

Electrodeposition Module

The Electrodeposition Module brings the power of COMSOL Multiphysics to electrochemical processes for such diverse applications as chrome plating in automotive industry, e-coating, electro-coloring, decorative electroplating, and electrodeposition for PCB manufacturing.

Microfluidics Module

The Microfluidics Module brings easy-to-use tools for the study of microfluidic devices and rarefied gas flows. Important applications include simulations of lab-on-a-chip devices, digital microfluidics, electrokinetic and magnetokinetic devices, inkjets, and vacuum systems.

Simulations of an electrowetting lens (left) and molecular flow (right) using the Microfluidics Module.

LiveLink™ for SpaceClaim®

The new LiveLink for SpaceClaim brings you the fusion of direct modeling and multiphysics simulation in a tightly integrated environment, enabling optimal designs and collaboration across CAD and CAE teams

COMSOL Multiphysics 4.2